An XFP pluggable transceiver line is designed for high-speed 10 Gigabit network connections such as OC-192/STM-64, 10G Fibre Channel, G.709, and 10G Ethernet. The CWDM line covers 8 wavelengths (expandable to 16 wavelengths) and comes in ER and ZR versions. The DWDM version allows system designers to replace legacy 300 pin transponders with pluggable XFP transceivers.
NeoPhotonics
San Jose, CA
www.neophotonics.com
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PRESS RELEASE
NeoPhotonics Expands Portfolio of XFP Transceivers for High-Speed Networks
CWDM and DWDM XFP Options Augment NeoPhotonics Portfolio of High-Speed Transceivers
San Jose / Shenzhen – NeoPhotonics announced today new CWDM and DWDM options in its XFP pluggable transceiver line to meet the growing need for high-speed “10 Gigabit” network connections such as OC192/STM-64, 10 G Fibre Channel, G.709, and 10 G Ethernet. Compliant with the XFP 10 Gigabit Small Form Factor Pluggable MSA Revision 4.5, NeoPhotonics’ expanded XFP line gives system designers flexibility in configuring their platforms for different network applications and allows carriers to offer more service connections “per shelf” as the transceivers physically separate the optical interface from the rest of the system hardware.
NeoPhotonics’ CWDM XFP line covers 8 wavelengths, yet is expandable to all 16 and will be offered in ER (40 km reach) and ZR (80 km reach) options. The DWDM line will cover all 40 ITU compatible wavelengths in the C-band and is available in ER and ZR versions as well.
These new XFP options enhance NeoPhotonics’ existing line of high-speed pluggable transceiver modules. The CWDM version is aimed at next generation Metro platforms where transmission rates are migrating from 2.5 Gbps to 10 Gbps per wavelength. The DWDM version will allow system designers to replace legacy 300 pin transponders with more cost effective pluggable XFP transceivers that decrease both space requirements and the thermal load on next generation transport platforms.
“These new XFP options complement well our current portfolio of high speed transceivers, which are widely deployed in networks around the world, and help solidify our position as one of the leaders in standard MSA transceivers,” said Ferris Lipscomb, VP Marketing of NeoPhotonics. “Our XFP transceiver line is designed to meet the stringent performance and reliability requirements of current metro and long-haul transport networks and builds on our experience in several segments of the optical components market. We leverage both our conventional manufacturing as well as our ‘PIC,’ or photonic integrated circuit capabilities, which embody our commitment to innovation and technology leadership in optical components.”
About NeoPhotonics
NeoPhotonics Corporation is a leading developer and vertically integrated manufacturer of photonic integrated circuit (PIC) based components, modules and subsystems for use in telecommunications networks. The Company’s products include active semiconductor, passive PLC and MEMS multi-dimensional switching functions in a single product. This integration is enabled by nano-materials and nano-scale design and fabrication technologies. Backed by leading venture capital firms and institutional investors, NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley and Shenzhen, China.
NeoPhotonics and the red dot logo are trademarks of NeoPhotonics Corporation. All other marks are the property of their respective owners.
www.neophotonics.com