EPM-2890 thermally conductive, non-corrosive, one-part white silicone adhesive exhibits ≤1% weight loss when heated for 30 min at 275ºC to withstand lead-free solder reflow. It can be used as an adhesive or sealing, caulking, or potting material in electronics applications, such as bonding for ruggedizing LCD displays, or any application containing grooves or other configurations that require a non-slumping and non-flow to limited-flow material. Specifications include 100 psi minimum primer-less adhesion on aluminum, thermal conductivity at 0.6 W/(mK), and an extrusion rate of 40 g/min.
NuSil Technology
Carpinteria, CA
www.nusil.com
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PRESS RELEASE
NUSIL RELEASES THERMALLY CONDUCTIVE SILICONE ADHESIVE FOR ELECTRONICS INDUSTRY
With low viscosity and low ionic and volatile content, EPM-2890 is ideal for applications requiring a broader operating temperature range.
Carpinteria, California — March 29, 2011 —NuSil Technology LLC (http://www.nusil.com), a global manufacturer of silicone-based materials for aerospace, electronics, photonics and healthcare industries, introduces EPM-2890, a thermally conductive, non-corrosive silicone adhesive. This addition to NuSil’s electronics product line provides moderate heat transfer between electrical components and their heat sinks. In addition, EPM-2890 exhibits less than or equal to 1 percent weight loss when heated for 30 minutes at 275ºC to withstand lead-free solder reflow.
NuSil’s EPM-2890 is a one-part, white silicone adhesive that will room-temperature vulcanize, with moisture, in 72 hours. It can be used as an adhesive or sealing, caulking or potting material in electronics applications that require minimal volatility to avoid condensation in sensitive devices. For applications in which adhesion is important (for example, bonding for ruggedizing LCD displays), EPM-2890 offers 100 psi minimum primer-less adhesion on aluminum. It provides enhanced thermal conductivity at 0.6 W/(mK) for applications in which stress relief during thermal cycling and heat management are desired.
EPM-2890 is ideal for any application containing grooves or other configurations that require a non-slumping and non-flow to limited-flow material. It is sold in a convenient, one-part configuration, which is easy to handle and ensures homogeneity. EPM-2890 has an extrusion rate of 40 grams per minute, making it easy to apply and ideal for confined spaces where a thin bond line is required.
“EPM-2890 is a great addition to NuSil’s thermal management product line,” said Brian Nash, Vice President of Sales and Marketing. “The product is excellent for many applications in electronics today that require a material with excellent thermal conductivity and adhesion.”
EPM-2890 is ROHS-compliant. It has low sodium, potassium and chloride content to help prevent corrosion of electronic components, while the low volatility helps with reducing contamination in environments where heat and vacuum are present.
For more information, please contact NuSil, or visit http://www.nusil.com/products/engineering/electronics.
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