Cutting laser from Corning processes micromaterials

Feb. 20, 2017
The 45G NX laser system is designed for cutting and drilling strengthened and non-strengthened glass and other crystalline materials, and processing micromaterials.

The 45G NX laser system is designed for cutting and drilling strengthened and non-strengthened glass and other crystalline materials, and processing micromaterials such as OLEDs, polyimide, wafers, ceramics, and plastics. The processing head moves with a maximum speed of 1000 mm/s and an acceleration of up to 10 m/s2.
Corning
Corning, NY

www.corning.com

Sponsored Recommendations

Hexapod 6-DOF Active Optical Alignment Micro-Robots - Enablers for Advanced Camera Manufacturing

Dec. 18, 2024
Optics and camera manufacturing benefits from the flexibility of 6-Axis hexapod active optical alignment robots and advanced motion control software

Laser Assisted Wafer Slicing with 3DOF Motion Stages

Dec. 18, 2024
Granite-based high-performance 3-DOF air bearing nanopositioning stages provide ultra-high accuracy and reliability in semiconductor & laser processing applications.

Steering Light: What is the Difference Between 2-Axis Galvo Scanners and Single Mirror 2-Axis Scanners

Dec. 18, 2024
Advantages and limitations of different 2-axis light steering methods: Piezo steering mirrors, voice-coil mirrors, galvos, gimbal mounts, and kinematic mounts.

Free Space Optical Communication

Dec. 18, 2024
Fast Steering Mirrors (FSM) provide fine steering precision to support the Future of Laser Based Communication with LEO Satellites

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!