The FINEPLACER Lambda 0.5 µm die bonder has uses in precision die attach and advanced packaging of photonic devices. The semi-automated die bonder includes motorized rotation (theta) of die relative to the substrate and a dedicated control panel, which is helpful for large chips with dense pitch and small bumps that are usually being aligned with the two-point-alignment method. Applications include laser bar bonding with indium or gold/tin (including forming gas or formic acid), bonding of VCSELs/photodiodes, silicon photonics, and LED assembly, as well as an integrated dispense for photonic applications.
SPIE Photonics West booth number: 4644
To Learn More:
Contact: Finetech
Headquarters: Gilbert, AZ
Product: FINEPLACER Lambda die bonder
Key Features: Motorized rotation
What Finetech says:
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