Hema Imaging brings low-cost thermal vision to the Internet of Things
IMAGE: A low-cost thermal imaging system will address Internet of Things applications in the diagnosis of thermal issues in homes and offices. (Image credit: Hema Imaging)
Hema Imaging (Bay Village, OH) is introducing a low-cost thermal imaging technology called HemaVision that is now available for pre-order on Kickstarter as part of a funding effort meant to bring low-cost thermal imaging to Internet of Things applications. The HemaVision is a smart thermal imaging system that uses computer vision to diagnose thermal problems within equipment, homes, offices, and buildings.
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"Through research I realized that any thermometer or thermal imager can tell you the temperature, but what people need is a tool that processes that data intelligently and diagnoses the situation. With the HemaVision, homeowners and professionals will be given information that helps them understand whether something is a concern or within normal limits," says Erik Beall, founder of Hema Imaging.
The HemaVision includes a shutterless thermal diode array with unprecedented image sensitivity and the platform includes modular image processing and computer vision software components.
Furthermore, the HemaVision is a stand-alone device that can withstand different environmental conditions and will connect wirelessly to a smartphone or WiFi network. All a user has to do is point and scan a scene using one of the applications. The HemaVision will then tag relevant parts of the images automatically and upload the tagged shots to a cloud account for analysis or reporting.
Funding is being sought through Kickstarter for development and manufacturing. With an early backer pledge level starting at $250, "crowd-funding" backers can secure a huge discount on the HemaVision over the 4 weeks it's available on Kickstarter. After the Kickstarter campaign ends, the device will be available at retail for $750.
SOURCE: Hema Imaging; http://www.hemaimaging.com/wp-content/uploads/HemaImaging_PressRelease_04_06_2015.pdf