Regensburg, Germany--OSRAM Opto Semiconductors has announced new packaging technology for its infrared (IR) emitter diodes and detectors. The surface-mount technology (SMT) devices, Molded Interconnect Device Light Emitting Diodes (MIDLEDs), have a unique construction that offers electrical contact pads on both the bottom and side of the package. This enables the same part to be either used as a top-facing (Z axis) or side-facing (X axis) solution, providing greater design flexibility.
The MIDLED package additionally provides an internal metalized reflector as well as a beam angle of +/- 20 degrees, enabling three times the output intensity of existing TOPLED emitters at a fraction of the size. OSRAM is presenting its new family of MIDLEDs at Electronica, November 9-12, 2004 in Munich, Germany.
"We are very excited to announce the next generation of our well-established IR SMT family," said Karl Leahy, infrared products marketing manager, OSRAM Opto Semiconductors. "By miniaturizing our packaging and adopting internal reflectors that make lenses obsolete, we again lead the way in product innovation and offer more flexibility and options to our customers. This is an exciting breakthrough in infrared packaging technology."
The MIDLED package, with its internal lens, is ideal for applications where highly focused infrared light is required, yet there is no space for large components with lenses. These applications include steering-angle sensors, rain sensors, light curtains, miniature interrupters, coin changers, reflective sensors, IR data transmitters and remote controls.