Build on the foundation of the NSX Series of advanced packaging defect inspection products, the NSX 320 System is specifically optimized for TSV processes, including 2D/3D metrology...
The Explorer Cluster allows individual systems to be configured with any combination of wafer front, back, and edge inspection modules allowing the user to mix and match inspection...
Automated macro defect inspection system using gray-scale image analysis with color image capture to provide fast, accurate inspection and metrology in LED manufacturing applications...