Cutting is one of the first material processes that have been overtaken by laser-based machines. Nevertheless, challenges are still present and improvements can be implemented, e.g. in the treatment of different materials and the approach to different thicknesses, from millimeter to centimeter-thick plates. The full value chain including components manufacturers, system integrators and end-users will discuss how to optimize the laser-based cutting process, increasing throughput and diversifying applications. During these online technology meetings, we are looking for the challenges the industry is facing and bringing together the entire supply chain to address these challenges.