OpTek Systems to display laser cleaver at LASER World of Photonics 2015
The LaserCleave laser cleaver prepares and terminates optical fibers using a non-contact laser process to avoid the potential for mechanical damage and deliver a surface free of chips, cracks, scratches, and other surface defects. This helps to improve laser damage threshold, particularly at higher power levels.
LASER World of Photonics booth number: B2.203
To Learn More:
Contact: OpTek Systems
Headquarters: Abingdon, Oxon, England
Product: LaserCleave laser cleaver
Key Features: Non-contact laser processing
What OpTek Systems says:
View more information on the LaserCleave laser cleaver.
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LFW Staff
Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.