Nextreme Thermal Solutions is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder, the industry-standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers, and sensors. The OptoCooler HV14 module is a high-heat-pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3 mm2. The module can create a temperature differential of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices such as laser diodes.
Nextreme Thermal Solutions
Research Triangle Park, NC
www.nextreme.com
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PRESS RELEASE
NEXTREME ANNOUNCES HIGH TEMPERATURE GOLD-TIN THERMOELECTRIC MODULE FOR OPTOELECTRONIC COOLING
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder — the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors.
The OptoCooler HV14 module is a high heat pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3mm². The module can create a temperature differential of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices such as laser diodes.
AuSn solder provides excellent joint strength, strain resistance and thermal conductivity. After the initial reflow during device assembly, the melting point of this particular AuSn solder is 320°C, enabling subsequent attachment of laser diodes and other devices to Nextreme's thermoelectric modules at lower temperatures, typically at 283°C, which is the industry standard. The use of this strain resistant material is particularly important for the laser diodes where movement of solder as little as 10 µm can cause significant alignment issues.
"Nextreme now offers the standard for solder assembly established by the optoelectronics industry," said Dr. Paul A. Magill, vice president of marketing and business development for Nextreme. "The introduction of gold-tin in the HV14 product line addresses our customers' most challenging assembly requirements."