The Third International Conference on Micro Opto Electro Mechanical Systems (MOEMS '99; Mainz, Germany), organized by the Institute of Microtechnology Mainz, drew more than 100 participants from the USA, Asia, and Europe to discuss recent problems and developments in this rapidly expanding field of research. A growing number of groups are active in this strongly interdisciplinary field that originates both from microelectronics and micromechanics, as well as from optics.
Interest in MOEMS is driven by the variety of potential applications in optical communications, both in the long-haul and datacom fields, sensors, and imaging. This fact was documented by the large number of talks authored or coauthored by corporate researchers and by the large number of participants from industry.
The possibility of high-precision hybrid integration of microsystems and the importance of advanced packaging concepts were pointed out in a number of talks that highlighted the state of the art in microsystem products. While the conventional silicon-based systems-on-chip solution will hold for high-volume products, systems-on-package is regarded as the challenge for MOEMS production in the near future. The proceedings of the Aug. 31Sept. 1, 1999, conference can be ordered from Hans-Dieter via e-mail: [email protected].
Hans-Dieter Bauer, director of the optics department at the Institut fur Mikrotechnik Mainz GmbH, Germany