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    • Julius Ortega

    Senior Applications Engineer, MRSI (Mycronic Group)

    Julius Ortega is Senior Applications Engineer at MRSI (Mycronic Group), Tewksbury, MA. 

    FIGURE 1. During experimental testing, the MRSI-H-LD die bonder achieves a placement repeatability in the X and Y directions of less than 1 μm and 0.5 μm (@3σ), respectively.
    Lasers & Sources

    High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges

    Limin Zhou
    Feb. 18, 2020
    A die bonder for packaging high-power laser diodes provides flexibility for both chip and bar on submount without changeover.