Laser drilling and cutting system

LPKF (Garbsen, Germany) has introduced its MicroLine 5000 ultraviolet (UV) laser-based flex drilling system, which has a 21 × 24in. working area and is available in two different laser power classes, depending on needs for various substrates and thicknesses. The system is equipped with precise process monitoring systems as well as intelligent vision systems for fiducial recognition and alignment. Although the system is mainly focused on high-speed drilling of both blind vias and through-holes, it also has utility in contour cutting of flexible circuits. With a 20μm laser beam spot size, it allows for precise cuts of intricate flex circuit geometries. The laser system operates in the UV wavelength, allowing it to drill and cut delicate substrate materials with a minimal heat-affected zone. The system can also be configured for reel-to-reel handling of flex substrates.

For more information, please visit www.lpkf.com.