SLPC extends abstract submission date

Dec. 30, 2013
SLPC2014, which deals with the science and technology of smart laser materials processing, will be held from April 22 to 24 in Yokohama, Japan.

Osaka, Japan - The organizers of the First Smart Laser Processing Conference (SLPC2014) have extended the abstract submission due date to January 31, 2014. So far, they have received abstracts from seven countries and have invited 12 speakers with a few more to be added. The conference will be held from April 22 to 24 in Yokohama, Japan.

SLPC2014 deals with the science and technology of smart laser materials processing including micro and macro. The three-day event will have a plenary session, oral sessions and poster session.

The aim of this conference is to provide a forum for discussion of fundamental aspects of laser-matter interaction, the state-of-the-art of smart laser processing, and topics for the next generation with fundamental scientists, end users and laser manufacturers. They expect SLPC2014 will play an important role for understanding the fundamental knowledge of laser processing and also to forecast future laser processing technologies and the future fields. During the conference, the Optics and Photonics International Exhibition is held jointly at the conference site.

Researchers and engineers are encouraged to visit the revised homepage at http://www.jlps.gr.jp/slpc2014/.

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