Chemnitz, Germany – In November, 3D-Micromac AG was honored with an Excellence Award for the development of the innovative laser micromachining system microFLEX, which is used for laser processing of thin films on flexible substrates.
The award was given at the Taiwan Printed Circuit Association Show, one of the world’s largest trade fairs for material and production technologies in the printed circuit board (PCB) industry, and the Taiwan Laser Application Forum.
The microFLEX™ system by 3D-Micromac AG works by way of reel-to-reel laser processing and is thus able to drastically reduce the cost for the production of components, like sensors and RFID-chips. The company was also recognized for its continuous engagement in industry-oriented research work in Taiwan.
"This award is a milestone and honors our involvement in one of the most promising markets for flexible and printed electronics," Tino Petsch, CEO of 3D-Micromac, declared.
3D-Micromac AG has been successfully engaged in the development and commercialization of laser micromachining systems for the processing of flexible thin film for many years now.
Altogether, eight prizes in different categories were awarded to leading research centers, academies and companies for their pioneering achievements and innovative developments of laser products and systems.