Selective laser annealing system
The microPRO RTP laser annealing system from 3D-Micromac (Chemnitz, Germany) combines a laser optic module with the company's modular semiconductor wafer processing platform to provide selective annealing with high repeatability and throughput. Features include a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths (near-infrared, green, and ultraviolet). The system addresses a variety of applications, including semiconductor, power device, and MEMS manufacturing.
For more information, please visit www.3d-micromac.com.
Industrial Laser Solutions Editors
We edited the content of this article, which was contributed by outside sources, to fit our style and substance requirements. (Editor’s Note: Industrial Laser Solutions has folded as a brand and is now part of Laser Focus World, effective in 2022.)