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    1. Laser Processing

    Ion beam trimming system offers subnanometer removal

    July 11, 2024
    The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials.
    (Image credit: scia Systems)
    667b297f5ed6f00aec424225 Scia Systems

    The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials. Film thickness homogeneity can be adjusted to the atom level of 0.1 nm. It offers subnanometer removal with a zero base etch function and no edge exclusion using an electrostatic chuck. 
    scia Systems
    Chemnitz, Germany
    www.scia-systems.com

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