The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials. Film thickness homogeneity can be adjusted to the atom level of 0.1 nm. It offers subnanometer removal with a zero base etch function and no edge exclusion using an electrostatic chuck.
scia Systems
Chemnitz, Germany
www.scia-systems.com
LFW Staff
Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.