3D-Micromac AG acquires thermal-laser-beam-separation wafer dicing technology from Jenoptik

Chemnitz, Germany--Jenoptik and 3D-Micromac AG have announced a technology transfer, concerning the technology of thermal-laser-separation (TLS) semiconductor-wafer dicing, as part of an asset deal between the two companies. As of January 1, 2014, the know-how, patents, and development results from Jenoptik’s Laser & Materials Processing Division have been transferred to 3D-Micromac AG in Chemnitz.

How TLS dicing works

TLS dicing (thermal laser-beam separation) is used in the semiconductor industry’s back-end to separate semiconductor wafers into individual components. A laser heats up the material locally and a cooling medium cools it down immediately afterwards; the resulting thermally induced mechanical stress leads to a complete cleaving of the wafer.

The method is suitable for most brittle materials in the semiconductor industry, including silicon, silicon carbide, germanium, and gallium arsenide wafers. TLS dicing produces clean, microcrack-free edges, which increase bending strength. Process speeds of 200 to 300 mm/s are possible.

3D-Micromac plans to immediately commercialize the technology. Jenoptik’s Laser & Materials Processing Division will continue in the future to focus on the 3D processing of plastics and metals, for example in the automobile industry.

"In the coming months, we will continue to further develop the process in cooperation with the Fraunhofer IISB [Erlangen, Germany] and implement it in industry-ready machine technology," says Tino Petsch, CEO of 3D-Micromac AG.

Source: http://tls-dicing.com/3d-micromac-acquires-tls-dicing/