A line of high-speed vertical-cavity surface-emitting laser (VCSEL) chips offer a data rate of up to 40 Gbit/s. The 850 nm VCSELs and VCSEL arrays (1 × 4 and 1 × 12) feature a -3 dB modulation bandwidth of 20 GHz and a HAB contact pad design that overcomes the problems of thick and soft planarization layers. The VCSELs also comply with the standard 250 µm device-to-device pitch.
VI Systems
Berlin, Germany
www.v-i-systems.com
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PRESS RELEASE
VI Systems launches VCSEL with HAB pad design for up to 40 Gbit/s
VI Systems has launched a new product line of high speed VCSEL chips that operate with data rates of up to 40 Gbit/s. The new generation of high-speed 850 nm VCSEL dice and VCSEL arrays feature an ultrahigh modulation bandwidth of 20 GHz and a novel HAB contact pad design suitable for ultra-robust bonding and packaging.
BERLIN, Germany - VI Systems GmbH (VIS), a leader in optical engines and components has launched a new product line for high speed VCSEL chips with a data rate of up to 40 Gbit/s. VIS' new generation of high-speed 850 nm VCSELs and VCSEL arrays (1x4 and 1x12) feature an ultrahigh -3 dB modulation bandwidth of 20 GHz and a novel HAB contact pad design that overcomes the problems of thick and soft planarization layers, characteristic to high-speed VCSEL designs, and enables ultra-robust bonding and packaging. VIS’ novel manufacturing approach and array designs are in compliance with the standard 250 µm device-to-device pitch (linear spacing) allowing systems developers to dramatically extend their capabilities in energy efficient data communication. Die-level samples are available now.
About VI Systems
VI Systems GmbH, based in Berlin, Germany, is a fabless developer and manufacturer of optical engines and optoelectronic components for communication, industrial, and consumer applications. Additional information about VI Systems may be found on the Internet at: www.v-i-systems.com
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