Laser engine chips from Intense Ltd. available in free-space and fiber-coupled versions
Two new 808 nm multimode laser engine chips include the Power Core 25 µm device at 0.5 W and the 45 µm device at 2.0 W. They are intended to be packaged in 9 mm cans in both free-space and fiber-coupled versions. In the fiber-coupled configuration, the diodes are offered with a standard 60 µm core diameter with 0.15 NA. They are designed for thermal print, graphics, and coding applications.
Intense Ltd.
North Brunswick, NJ
www.intenseco.com
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PRESS RELEASE
Intense Ltd. Expands Power Core 808, Ultra High Brightness Laser Engine Chip Platform
North Brunswick, New Jersey -- 1 March 2010 -- Intense Ltd., developer of next generation semiconductor lasers, systems and solutions, today announced the release of two new Ultra High Brightness versions of the Power Core 808, a line of 808 nm multi mode laser engine chips that are easily customized to a wide variety of optics applications. The devices are ultra high brightness, low divergence, free space laser diodes with 25µm and 45µm apertures. Designed for thermal print, graphics, and coding applications, the small emitting apertures with low beam divergence produce very high brightness in a small, simple-to-integrate, chip-level device.
The Power Core 25µm device is offered at 0.5W. The 45µm device is available at 2.0W. These high brightness, multi mode laser diodes are designed to be packaged in 9mm cans in both free space and fiber coupled versions. In the fiber coupled configuration, the diodes are offered with a standard 60µm core diameter with 0.15 numerical aperture.
"These lasers represent some of the industry's highest output power levels from small aperture devices," stated Kevin Laughlin, Chief Commercial Officer at Intense Ltd. "We have leveraged our patented QWI technology to develop high power sources, making these ultra high brightness lasers extremely reliable and therefore able to meet the demands of the print & imaging and coding & marking markets. These lasers are ideally suited for applications where compact devices capable of being focused into a small spot provide key advantages in simplifying the design of print and thermal coding and marking heads."