Optics

SEMICONDUCTOR PROCESSING

Nov. 1, 1994

The production of nextgeneration 256Mbit DRAM (dynamic randomaccess memory) chips with optical lithography will require writing feature sizes of less than 0.5 µm. Researchers at Rice University (Houston, TX) and Texas Instruments (Stafford, TX) developed an interferometric phaseshifting method that uses a singlelayer chromium mask to record patterns in UV photoresist. This method offers significant resolution and contrast enhancement over conventional trans mission photolithography processes

Interferometric method promises subhalfmicron optical lithography

Optoelectronics gains competitive ground

Continue Reading

Back to the future of electronic autocollimation

Optical design software: From nano to system scale

Sponsored Recommendations

Hexapod 6-DOF Active Optical Alignment Micro-Robots - Enablers for Advanced Camera Manufacturing

Dec. 18, 2024

Optics and camera manufacturing benefits from the flexibility of 6-Axis hexapod active optical alignment robots and advanced motion control software

Laser Assisted Wafer Slicing with 3DOF Motion Stages

Dec. 18, 2024

Granite-based high-performance 3-DOF air bearing nanopositioning stages provide ultra-high accuracy and reliability in semiconductor & laser processing applications.

Free Space Optical Communication

Dec. 18, 2024

Fast Steering Mirrors (FSM) provide fine steering precision to support the Future of Laser Based Communication with LEO Satellites

White Paper: Improving Photonic Alignment

Dec. 18, 2024

Discover how PI's FMPA Photonic Alignment Technology revolutionized the photonics industry, enabling faster and more economical testing at the wafer level. By reducing alignment...