EPIC launches 'PICs for everyone' resource in Europe

Aug. 3, 2016
EPIC announced the PICs4All (Photonic Integrated Circuits Accessible to Everyone) project.

The European Photonics Industry Consortium (EPIC; www.epic-assoc.com) announced the PICs4All (Photonic Integrated Circuits Accessible to Everyone) project (see http://pics4all.jeppix.eu/), a coordination and support action from the EU Horizon 2020 (H2020) Information Communication Technologies (ICT) program whose purpose is to bring companies closer to Photonic Integrated Circuit (PIC) technology. Among other goals, the program assists developers with gaining access to advanced fabrication facilities for PICs.

RELATED ARTICLE: PIX4life targets biophotonics with visible range PICs, development capacity build

EPIC says the PIC development value chain can become a jungle of complexities since one needs to choose from a variety of modeling/design and layout software, technology platforms, packaging solutions, and also keep in mind PIC testing requirements.

PICs4All aims at low-cost development of ASPICs (application-specific PICs) using the generic foundry model, and rapid prototyping via industrial Multi-Project Wafer runs. To this end, PICs4All brings together the PIC-value chain of Europe's key players in the field of photonic integration, including manufacturing and packaging partners, photonic CAD software partners, R&D labs and Photonic IC design houses.

EPIC adds that PICs4All has set up a European Network of experts in photonics comprised of nine Application Support Centers (ASCs) distributed around Europe whose main task is to stimulate the development of novel applications based on Photonic ICs for various application fields, enhance cooperation between universities, clusters, industry, and research centers, and most importantly, enable access to the PIC technology.

The PICs4All ASCs offer advice on the technical and economic viability of your PIC idea, support in conceptualization, design and testing of Photonic ICs and guidance in access to manufacturing and packaging services through different platform technologies, covering the whole PIC development value chain.

For further details, contact Carlos Lee, director general of EPIC at [email protected].

SOURCE: EPIC; https://www.linkedin.com/groups/2955260/2955260-6166194582720692225

Sponsored Recommendations

Electroplating 3D Printed Parts

Jan. 24, 2025
In this blog post, you'll learn about plating methods to enhance the engineering performance of resin micro 3D printed parts.

Hexapod 6-DOF Active Optical Alignment Micro-Robots - Enablers for Advanced Camera Manufacturing

Dec. 18, 2024
Optics and camera manufacturing benefits from the flexibility of 6-Axis hexapod active optical alignment robots and advanced motion control software

Laser Assisted Wafer Slicing with 3DOF Motion Stages

Dec. 18, 2024
Granite-based high-performance 3-DOF air bearing nanopositioning stages provide ultra-high accuracy and reliability in semiconductor & laser processing applications.

Steering Light: What is the Difference Between 2-Axis Galvo Scanners and Single Mirror 2-Axis Scanners

Dec. 18, 2024
Advantages and limitations of different 2-axis light steering methods: Piezo steering mirrors, voice-coil mirrors, galvos, gimbal mounts, and kinematic mounts.

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!