January 16, 2008, San Jose, CA--Tessera Technologies has licensed its OptiML wafer-level camera technology and SHELLCASE wafer-level chip-scale packaging solutions to Nemotek S.A. (Morroco). According to the companies, the combination of these consumer optics technologies enables Nemotek to offer a full range of cost-efficient camera solutions from wafer-level packaging of image sensors and wafer-level lenses to fully-integrated camera modules.
Nemotek is the first company to license both the OptiML and SHELLCASE technologies from Tessera. With these solutions, it will provide image sensor packaging services and camera module design and assembly for applications including mobile phones, laptop computers, security and automotive devices.
"By leveraging the complete suite of wafer-level camera technologies from Tessera, Nemotek is positioned to be a broad-based supplier of camera solutions for the mobile phone market," said Michael Bereziuk, chief operating officer, Tessera. "Morocco's close ties to the industry's leading mobile phone vendors, as well as their close proximity to the European business community, will enable Nemotek to drive further adoption of Tessera's OptiML and SHELLCASE technologies, enabling the next-generation of wafer-level consumer optics solutions."
Nemotek is a recently established company led by Mohamed Lasry, the former chairman of STMicroelectronics-Morocco, who was brought on as chief executive officer to help drive the company's vision.
"This is the beginning of a long partnership with Tessera, as their industry-leading technologies will not only enable Nemotek to be a key player within next-generation wafer-level optic technologies, but also supports the Moroccan strategy to become a leading region for knowledge and innovation," said Mohamed Lasry, chief executive officer, Nemotek. "This agreement, combined with Morocco's unique advantages, including cost competitiveness and large, world-class skill pool, will enable us to play a key role within the electronics industry."
Nemotek expects to begin volume shipments of its Tessera technology-based offerings in January 2009, with capacity plans for more than 150 million wafer-level camera units and 250 thousand image sensor wafers per year.