Maskless Lithography comes out of stealth mode

April 8, 2010
Maskless Lithography, a Silicon Valley startup led by a group of industry veterans, has unveiled a new direct-write digital-imaging technology for printed-circuit-board (PCB) production.

San Jose, CA--Maskless Lithography, a Silicon Valley startup led by a group of industry veterans, has come out of stealth mode, revealing a new direct-write digital-imaging technology for printed-circuit-board (PCB) production.

Uses ordinary resists
According to the company, its MLI-2027 direct-write lithography system is the industry's first to combine high throughput and yield with unparalleled accuracy using standard "non-laser-direct-imaging" resists. Based on its patented Gray Level Imaging (GLI) technology, the MLI-2027 offers high printing speed on conventional dry-film resists with real-time distortion correction.

Maskless said that Sanmina-SCI Corporation (San Jose, CA) has accepted the first production tool after completing beta testing, validation, and qualification. "The acceptance of this tool marks five years of development coming to fruition," stated Dan Meisburger, founder and CTO of Maskless Lithography. "In 2005, based upon our founding partners' experience in both lithography and metrology, we identified an opportunity to develop a lithography system that could deliver unrivalled value to the PCB market. We believe we have exceeded that initial vision and are now ready to share this tried and tested capability."

Meisburger founded Maskless Lithography in 2005; he has previously held senior roles at Ultratech Stepper, IBM, Hewlett-Packard and KLA-Tencor, where he was responsible for developing the world's first high-speed electron-beam wafer-inspection tool.

"We are really impressed with Maskless' unique direct-write lithography tool," said Mike Keri, vice president of operations for Sanmina-SCI. "The MLI-2027 has allowed us to meet highly challenging designs using conventional dry film resists at high yields and high throughput rates."

For more information, see www.maskless.com.

About the Author

John Wallace | Senior Technical Editor (1998-2022)

John Wallace was with Laser Focus World for nearly 25 years, retiring in late June 2022. He obtained a bachelor's degree in mechanical engineering and physics at Rutgers University and a master's in optical engineering at the University of Rochester. Before becoming an editor, John worked as an engineer at RCA, Exxon, Eastman Kodak, and GCA Corporation.

Sponsored Recommendations

Hexapod 6-DOF Active Optical Alignment Micro-Robots - Enablers for Advanced Camera Manufacturing

Dec. 18, 2024
Optics and camera manufacturing benefits from the flexibility of 6-Axis hexapod active optical alignment robots and advanced motion control software

Laser Assisted Wafer Slicing with 3DOF Motion Stages

Dec. 18, 2024
Granite-based high-performance 3-DOF air bearing nanopositioning stages provide ultra-high accuracy and reliability in semiconductor & laser processing applications.

Steering Light: What is the Difference Between 2-Axis Galvo Scanners and Single Mirror 2-Axis Scanners

Dec. 18, 2024
Advantages and limitations of different 2-axis light steering methods: Piezo steering mirrors, voice-coil mirrors, galvos, gimbal mounts, and kinematic mounts.

Free Space Optical Communication

Dec. 18, 2024
Fast Steering Mirrors (FSM) provide fine steering precision to support the Future of Laser Based Communication with LEO Satellites

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!