November 29, 2007, BELLINGHAM, WA--Micro- and nanolithography practitioners will share their up-to-the-minute research results and latest innovations at the SPIE Advanced Lithography conference in San Jose, CA, February 24–29. Topics range from state-of-the-art lithographic tools and technologies, resists, metrology, and materials characterization, to design and process integration, and will include extending these technologies versus switching to emerging alternatives.
The SPIE Advanced Lithography event provides a rich networking opportunity for the international community and is known as a forum for technical presentations. More than 700 papers will be presented in five technical conferences. Papers of interest include topics on nanoimprint, electron-beam direct write, parallel e-beam systems, extreme-UV systems, directed self assembly, molecular resists, EUV resists, double patterning, and high-index immersion lithography.
Three plenary talks are scheduled. The first will be given by Martin van den Brink, executive vice president and member of the board of management of ASML (Veldhoven, the Netherlands), who will provide perspectives on what the chip and equipment industries need to do to continue advances that are becoming more and more difficult at increasingly higher costs.
In the second plenary, Mark Durcan, president and chief operating officer of Micron Technology (Boise, ID), will focus on how lithography options interact with memory device integration, and why future innovation is critical to the business of memory device manufacturing.
Andrew B. Kahng, professor of computer science and electrical engineering at the University of California, San Diego, will discuss how new roadmaps for partnership between lithography and design can guide semiconductor product teams in working through patterning, device, and circuit challenges with solutions such as software and 3D.
Expert panels will focus on topics including: Photomask Financial Fears: Fact, Fiction or Fabrication?, Future Projection Lithography: Optical or EUV?, Massively Parallel Tools for Nanotechnology: Applications in Lithography and Metrology, Enabling Accurate Optical Proximity Correction, and Reference Metrology. New courses on EUV lithography, double patterning, and electron-beam lithography and an expanded range of design for manufacturing (DfM) topics are among 27 courses and workshops offered on fundamentals and emerging approaches.
A two-day exhibition including approximately 120 companies will feature product demonstrations with question-and-answer sessions. For more information or to register, visit SPIE's Advanced Lithography conference website. --VC