Optical glass for microchips withstands EUV lithography

    Jan. 12, 2025
    EXTREME ULE (ultra-low expansion) titania-silicate glass material features near-zero expansion characteristics.
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    (Image credit: Corning)
    67532d22c3ab9d5b6f78b1ee Corning

    EXTREME ULE (ultra-low expansion) titania-silicate glass material features near-zero expansion characteristics. It withstands extreme ultraviolet (EUV) lithography, allowing chipmakers to improve photomasks critical for mass production of microchips for advanced artificial intelligence (AI) technologies. 

    Corning

    Corning, NY

    www.corning.com

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