Software & Accessories

Underfill epoxy features nanosilica filler material

June 10, 2024

EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications.

Related To: Master Bond

EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications. This optically clear compound features high dimensional stability with its nanosilica filler material and it has a glass transition temperature of >200°C.

Master Bond

Hackensack, NJ

www.masterbond.com

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