DUALBOND EG6290 is a sealant adhesive designed for CMOS image sensors, which are often used in driver monitoring systems. Glass filters can be bonded directly to the semiconductor chip. It offers a Young's modulus of 2350 MPa, glass transition temperature (Tg) > +130°C, and meets the AEC-Q100 Grade 2 automotive industry standard.
DELO Industrial Adhesives
Windach, Germany