Copper oxide-coated foam heat sink from Goodfellow offers ~37% relative density

Microporous copper foam coated with a thin, hard layer of copper oxide serves as a low-profile heat sink in passive cooling environments. The underlying structure of the heat sinks has pore sizes of 300–600 μm and a relative density of ~37%. The black copper oxide that coats the interconnected pores of the thermally conductive copper foam increases emissivity.
Goodfellow
Coraopolis, PA
www.goodfellowusa.com