Indium Corporation to feature gold alloy solder preforms at SPIE Photonics West 2019
A line of gold alloy(AuSn) solder preforms has high tensile strength to ensure high-reliability joining and sealing. The preforms are designed for high-reliability applications, such as lasers, photonics, microwave systems, medical, and aerospace. They are available in a variety of standard and custom-engineered designs.
SPIE Photonics West booth number: 3310
To Learn More:
Contact: Indium Corporation
Headquarters: Clinton, NY
Product: AuSn solder preforms
Key Feature: Available in standard and custom-engineered designs
What Indium Corporation says:
View more information on the company's AuSn solder preforms.
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