Wafer scanner from Raylase works with laser powers up to 2 kW
Nov. 12, 2018
The Superscan IV-15 Wafer two-axis deflection unit is designed for wafer manufacturing, including structuring solar cell wafers, when high angular velocity is required. The device's model-based digital control offers speeds up to 200 rad/s. It works with laser powers up to 2 kW when quartz mirrors are used. Lenses with optimized holders and scan mirrors are available for all standard lasers.
Raylase
Wessling, Germany
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