Film thickness software from CRAIC Technologies measures nondestructively
Jan. 10, 2015
FilmPro film thickness measurement software plugs into the company’s micro-spectro-photometers and their controlling Lambdafire software. It allows users to measure the thickness of thin films rapidly and non-destructively on transparent and opaque substrates. It can determine thickness on substrates such as semiconductors, MEMS devices, disk drives, and flat-panel displays.
CRAIC Technologies
San Dimas, CA
www.microspectra.com
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