Rudolph to grow semiconductor inspection product line with acquisition of Applied Precision

December 20, 2007, Flanders, NJ--Rudolph Technologies, a provider of process characterization equipment and software for thin-film measurement and macro defect inspection, signed an agreement to acquire the net assets of the semiconductor business of Applied Precision (Issaquah, Washington). Applied Precision is a provider of wafer probe card metrology systems and process management systems to semiconductor final manufacturing facilities.

Paul F. McLaughlin, chairman and CEO of Rudolph, said, "This acquisition combines two successful companies with complementary products and technologies, and will accelerate our efforts to be a more complete supplier of back-end equipment and software. As the consolidation of our industry continues, we believe our combined strengths will enable us to continue providing our customers with process characterization excellence to meet tomorrow's process challenges."

Nathan Little, executive VP and general manager of Rudolph's Inspection Business Unit said, "We are looking forward to combining operations with the newly-formed Probe Card Test and Analysis Division, and we expect to build on the new division's number one market share position in the probe card analytics market."

Terms of the transaction include a combination of cash and Rudolph Technologies common stock. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth.

For more information, visit www.rudolphtech.com.