Test & Measurement

Wafer thickness mapping system measures with 1 nm repeatability

Jan. 21, 2023

The TMS-2000 wafer thickness mapping system uses an interferometric detection technique with a high-speed tunable laser.

The TMS-2000 wafer thickness mapping system uses an interferometric detection technique with a high-speed tunable laser to measure the flatness of the wafer with up to 1 nm repeatability for global, site, and edge wafer measurements. Designed for industrial in-line inspection applications, it offers environmental stability.

Santec

Komaki, Japan

www.santec.com

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