Sony unveils stacked structure for CMOS sensors

Aug. 28, 2012
Tokyo, Japan--Sony Mobile Communications has developed miniature back-illuminated CMOS image sensors that contain pixels stacked over their electrical circuits rather than laid out beside them, saving space and improving the pixel percentage fill.

Tokyo, Japan--Sony Mobile Communications has developed miniature back-illuminated CMOS image sensors that contain pixels stacked over their electrical circuits rather than laid out beside them, saving space and improving the pixel percentage fill. The sensors, which are four to five millimeters square, come in 8 and 13 megapixel configurations.

The sensor series, dubbed "Exmore RS," has red-green-blue-white (RGBW) coding and a high-dynamic-range movie function. Sony says the RGBW coding function can capture sharp, clear images even when filmed or photographed in low-light conditions because it contains white pixels in addition to conventional RGB pixels.

The stacking technology will allow Sony to make smaller cameras for cellphones and other devices to help maximize space for larger screens. Sony will also bring to market three compact autofocus imaging modules equipped with autofocus and lens units optimized for the industry’s smallest 1.12 µm unit pixel size.

Sony says it is is committed to strengthening its production capacity for stacked CMOS image sensors. The company plans to invest in Sony Semiconductor Corporation's Nagasaki Technology Center in 2013 and 2014 to increase the production capacity for stacked CMOS image sensors. The investment will provide for new wafer-processing equipment for stacked CMOS image sensors, as well as increasing and transforming wafer lines capable of manufacturing CMOS image sensors. Sony plans to increase total production capacity for CCD and CMOS image sensors to approximately 60,000 wafers per month by the end of September 2013.

Sources: http://www.sony.net/SonyInfo/News/Press/201208/12-107E/index.html; http://www.sony.net/SonyInfo/News/Press/201206/12-084E/index.html

About the Author

John Wallace | Senior Technical Editor (1998-2022)

John Wallace was with Laser Focus World for nearly 25 years, retiring in late June 2022. He obtained a bachelor's degree in mechanical engineering and physics at Rutgers University and a master's in optical engineering at the University of Rochester. Before becoming an editor, John worked as an engineer at RCA, Exxon, Eastman Kodak, and GCA Corporation.

Sponsored Recommendations

Brain Computer Interface (BCI) electrode manufacturing

Jan. 31, 2025
Learn how an industry-leading Brain Computer Interface Electrode (BCI) manufacturer used precision laser micromachining to produce high-density neural microelectrode arrays.

Electro-Optic Sensor and System Performance Verification with Motion Systems

Jan. 31, 2025
To learn how to use motion control equipment for electro-optic sensor testing, click here to read our whitepaper!

How nanopositioning helped achieve fusion ignition

Jan. 31, 2025
In December 2022, the Lawrence Livermore National Laboratory's National Ignition Facility (NIF) achieved fusion ignition. Learn how Aerotech nanopositioning contributed to this...

Nanometer Scale Industrial Automation for Optical Device Manufacturing

Jan. 31, 2025
In optical device manufacturing, choosing automation technologies at the R&D level that are also suitable for production environments is critical to bringing new devices to market...

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!