EP3UF-1

Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. It is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF-1 is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF-1 to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP3UF-1 has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.EP3UF-1 also is a highly useful thermally conductive adhesive. Since the filler is thermally conductive and the particle size very small, as mentioned above, it can be applied in thin bond lines of 10-15 microns. This, in effect, lowers the thermal resistance and effectively increases the heat transfer properties of the system. For example, with a typical thermally conductive filler, a reasonable bond line thickness is about 50 microns. With this epoxy, the thermal resistance would be 30-50 x 10-6 Km2/W. However, when an epoxy such as EP3UF-1 is applied in thickeness of 10-15 microns, the thermal resistance drops to 5-7 x 10-6 Km2/W. Obviously, this is helpful in managing heat related issues. Some other noteworthy attributes of this system include the ability to bond well to a variety of substrates such as metals, composites, ceramics and many plastics. It has reasonably good resistance to a wide variety of waters, oils and fuels. The color of EP3UF-1 is light yellow. The service temperature range is -60°F to +250°F. EP3UF-1 is a highly effective thermal interface material for bonding and underfill applications in microelectronic packaging and assembly.Product AdvantagesOne component; no mixing; not premixed and frozenUnlimited working life at room temperatureExceptional flow propertiesRapid curing with versatile cure schedulesCan be used as an underfill for very tight spacesSmall particle size lowers thermal resistance