Master Bond

Hackensack, NJ 07601

COMPANY OVERVIEW

About Master Bond

Master Bond formulates high-quality, innovative compounds for the laser, optics, and photonics industries. Our goal is to help engineers meet specific requirements for their bonding, sealing, and coating applications.

Product Summary

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable adhesives are reliable, come in convenient packaging and feature outstanding performance properties.

Contact

154 Hobart St
Hackensack, NJ 07601
United States
https://www.masterbond.com
201-343-8983
201-343-2132

More Info on Master Bond

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Master Bond formulates high quality, innovative compounds for the laser, optics and photonics industries. Our goal is to help engineers meet specific requirements for their bonding, sealing and coating applications.

Key Benefits of Master Bond Adhesives, Sealants and Coatings

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable adhesives are reliable, come in convenient packaging and feature outstanding performance properties.  Each compound is designed to meet specific application needs and requirements, such as: 

In addition to outstanding optical properties, special grades of Master Bond epoxy adhesives and UV curable systems feature exceptional thermal, electrical and mechanical characteristics for electro-optical and fiber-optic applications. These products provide strong, durable bonds to a wide variety of similar and dissimilar substrates. Specific compounds vary in viscosity, cure speed, chemical resistance and electrical properties, and can be custom formulated to meet the needs of your specific application.

 Expert Technical Support

Our experienced application engineers provide individual support to help determine the best adhesive for your application.

Products

Ep21 Lvfl
Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility
Ep40 Tc Med
Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Supreme3 Dm 85
One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Ep5 Lte 100
One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C
Ep17 Htda 2
One component die attach epoxy system with exceptionally high glass transition temperature
Led415 Dc90
One component, flexibilized LED curable system
Ep41 S 5 Med
Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving
Supreme42 Ht 2 Nd Black
Two component, non-flow epoxy system for bonding, sealing and coating
Ep5 Tc 80
One component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C
Master Sil323 Ao Lo
Two part thermally conductive, electrically insulating silicone for bonding and sealing

Press Releases

Image courtesy of Master Bond
Master Bond UV15-7HP
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system.
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Master Bond EP29LPSPND-3
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically...
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Master Bond - Medical Grade, Dual Curable Adhesive
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
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EP53TC
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
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Master Bond Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...

Videos

Red Adhesive Turns Clear Upon Exposure to UV Light
UV15RCL adhesive is a UV curable, optically clear compound that changes from red to clear once exposed to UV light. This distinctive feature gives users the confidence that thorough...
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Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. Independent tests demonstrate that this epoxy’s abrasion resistance value is significantly...
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LED curable adhesive systems offer safe and rapid cures upon exposure to an LED light source. Learn how to properly apply and cure an LED curable adhesive system using a portable...

Resources

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UV11-3
Overview of UV11-3 Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around...
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EP30HT-LO
Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...
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Master Bond UV10TKLO-2
Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...
Mb Wp Thumbnail Optically Clear Adhesives 200x260
When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be...
Mb Wp Thumbnail Polymeric Systems Bring Clarity Optical Apps 200x262
Whereas some optical assembly applications require optical clarity across a certain wavelength, others require an opaque coating. Optical grade epoxies, silicones and UV curable...

Articles

(Image credit: Master Bond)
master_bond
Dual-cure UV15DC80-1Med epoxy uses UV light for initial fixation, followed by heat for complete polymerization.
(Image credit: Master Bond)
EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications.
Designed for medical device manufacturing, MasterSil 711Med is a one-component, medical-grade silicone adhesive that passes ISO 10993-5 testing for non-cytotoxicity.
The Supreme 17HTND-2 one-component epoxy system is thermally stable, with a glass transition temperature of 410°F.
Master Bond
EP5LTE-100 is a one-part, non-premixed, and frozen epoxy with a coefficient of thermal expansion (CTE) of 8-12 × 10-6 in/in/°C.
Master Bond
The LED415DC90 one-component adhesive system cures rapidly upon exposure to LED light at 405 nm.
Master Bond
Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing, and coating applications.
Master Bond
EP5TC-80 is a one-part, NASA low outgassing-rated epoxy with a thermal conductivity of 3.3 to 3.7 W/(m·K), with electrical nonconductivity.
Master Bond
The LED405FL3 flexible one-component, LED curing adhesive system offers high optical clarity and a refractive index of 1.51.
Master Bond
MasterSil 153AO is a two-part, electrically insulating, cured silicone.

KEY CONTACTS

Robert Michaels

VP Technical Sales

Buyer's Guide Listing Information

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Additional content from Master Bond

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EP21LSCL-2Med
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
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EP3HT-LO
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests...
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Number of VHP Cycles
Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...
Courtesy of Master Bond
Master Bond EP21ARHTND-2
Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was...
Courtesy of Master Bond
Master Bond Supreme 11AOHTLP
Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since...
Courtesy of Master Bond
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
Courtesy of Master Bond
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med
Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
Supreme17 Htnd 2
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working...
Ep21 Lvfl
Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram...
Ep40 Tc Med
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...
Ep17 Htda 2
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally...
Led415 Dc90
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...
Ep41 S 5 Med
Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...
Supreme42 Ht 2 Nd Black
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...
Ep5 Tc 80
Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity...
Master Sil323 Ao Lo
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep4 Cl 80 Med
One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications
Ep4 Cl 80 Med
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep40 Nd
Two component, room temperature curing epoxy with good toughness, paste consistency
Ep40 Nd
Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio...
Ep17 Tf
One component, toughened epoxy system for bonding, sealing and coating
Ep17 Tf
Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg)...
Uv17 Med
UV system for high performance bonding, sealing and coating featuring superb adhesion to thermoplastic urethanes (TPUs)
Uv17 Med
Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes), which are widely...
Master Sil 323
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...
Ep4 G 80 Med
Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to ...
Ep35 Aolv 0
Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications.
Ep35 Aolv 0
Two component, thermally conductive, electrically isolating epoxy system for bonding, sealing and potting
Ep21 Ac Dsc5959
Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0
Ep21 Ac Dsc5959
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Ep4 S 80
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.
Ep4 S 80
One component, silver filled epoxy with a curing temperature of 80°C
Ep40 Tc
Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
Ep40 Tc
Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing
Ep62 1 Ht Med
Two component, lower viscosity epoxy system featuring superior temperature and chemical resistance especially for repeated sterilization
Ep62 1 Ht Med
It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.
Mb Wp Thumbnail How Dual Curing Adhesives Uv Light Heat Improve Manufacturing 200x260 0
A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.
Led405 Fl3
One component, flexibilized LED curable system
Led405 Fl3
LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51.
Ep5 G 80
One Component, Graphite Filled Epoxy Features Electrical and Thermal Conductivity
Ep3 Hts Tc
Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
Ep41 S 5 Nd Black
Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
Ep30 4 Med
Two component, optically clear epoxy for medical device applications
Ep30 4 Med (1)
EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. This low viscosity system meets the requirements...
Master Sil153 Ao
Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
Supreme70 Cn
Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients
Master Bond
EP51CC is a two-component epoxy with a color-coding system to indicate proper mixing.
Ep77 M F Med
Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Ep51 Cc
Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond
UV15X-6Med-2LV is an optically clear, non-cytotoxic, one-part UV curable system that meets ISO 10993-5.
Ep21 Ns
Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance
Ep41 S 6
Two component epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. Key Features: Convenient...
Ep3 Uf 1
One component epoxy for bonding and underfill applications. Features: Thermally conductive. Excellent electrical insulator. Low viscosity. Ultra fine particle size
Ep35 Sp
Two component epoxy system for bonding, sealing and coating applications. Key Features: Exceptionally high glass transition temperature. Very long open time. Paste consistency...
Master Bond
The EP35SP two-part epoxy system provides resistance to chemicals such as oils, acids, bases, water, fuels, and petrochemicals.
Ep29lpsp
Two component epoxy compound for cryogenic applications
Shared User Pr3de7ec27fbe84af388cd95306a16959d
Master Bond EP21TP-2NV is a two component epoxy polysulfide system formulated to cure at room temperature or more rapidly at elevated temperatures, with a one to one mix ratio...
UV curable adhesives are among the most user friendly adhesive products on the market today—if you know how to apply them. For a closer look at the capabilities of UV curable...
Shared User Pra168ac2687e54d8ab2331b0b8f187736
Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications. UV10TK40M is optically clear...
Shared User Pr1ae5cdde506e493498db5ac35ccf1620
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition...
Shared User Prbf58a7b3fb74403ba2c6787cb3c00e1f
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals...
Shared User Usr7f54b8e2383746edb59698fe9572d9bd Mae
It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary...
Shared User Prd66c8286fa4e41ab95aef82cca85ce2b
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob ...
Shared User Prf5273ba3c91944db8984401bfbb5fee0
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use,...
Shared User Pr2fd0f0b0a2e04e91b21d84015d30ad5e
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy...
Shared User Pr7f80f7e9b34b44dbbdddf97cefbab52b
Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This ...
Shared User Pr0ca725b5b44046cfa1af3fc633a2e19f
Product:  UV22DC80-1Med Release Date:  04/22/2019  Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism...
Shared User Usr98efa11650f7463fb5f3a37086c9e61c Mae
“While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath,...
Shared User Precddd65e9a194d41ad4fd6ec49e118d4
One component, toughened, silver conductive epoxy system featuring good electrical conductivity and physical strength properties.
Shared User Pre37d0b4b68f949f494fb63729956aab8
Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior...
Shared User Pr3a09e8f13b5b4d768576f82b5265b1c5
Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies...
Shared User Pr5d0a9cb14f9d4d5e9087785b2293f46e
Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system...
Shared User Pr34ca854c8b2a4efab31f92da72f409a0
Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for ...
Led405 Med
Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated...
Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such...
Shared User Prf5811836585441ffa7111ba94ccf9085
Product:  EP3UF-1  Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable...
Shared User Pr533106d8859344f6801bdb7f7de19838
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. It is easily cured at elevated temperatures as low as 250°F. It is not premixed...
Shared User Pr24f7956b645743fb9a34e306c23a197e
Master Bond MasterSil 980 is two part fluorosilicone system for high performance bonding, sealing, coating and potting applications. It withstands harsh chemicals such as gasoline...
Shared User Pr8449c5553c2b4e7689662c1654c71331
Product:  EP41S-6  Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard ...
Shared User Pr0a394c4a792b4b20b015d8557676bc2a
Master Bond UV26 is a new one part UV curable system featuring an exceptionally high glass transition temperature (Tg) ranging from 160 to 170°C. This NASA low outgassing ...
Product:  EP17HTND-CCM Release Date:  11/26/2018   Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient...
Shared User Pre2b7042588254dd3b248eb9469c294eb
Product:  EP110F8-3 Release Date:  09/05/2018   Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications...
Shared User Pr2cd46401e471471c9ba451eeeb1dd616
Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly...
Shared User Usr7209a5db5b16432ba5fc669a5e1c0512 Mae
It is a low viscosity formulation with a mixed viscosity of 2,500 to 5,000 cps. With a long working life of 60 to 90 minutes and a variety of curing options, the optimal cure ...
Shared User Usr2e9ff22fdc0046b695fd43423f34bf36 Mae
Master Bond EP30LTE-2 is a highly dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,...
Shared User Prebf086cb00f143a497863a9fafbc08c9
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating...
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Product:  Supreme 62-1 Release Date:  06/04/2018   Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1. It...
Shared User Pr414ab69500ab4af88ccc97b0d1fc6cf7
Supreme 62-1 has excellent physical strength properties and a glass transition temperature of 155-160°C. This two part epoxy delivers superior chemical resistance against acids...
Shared User Prfd66759d7bb54027b2f682fd8e01b9ab
Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections ...
Shared User Prffd158d27aaa431e98289f6180a1de63
Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications. It possesses a low mixed viscosity of 1,000 cps,...