The SST 3150 is designed to create high reliability MEMS packages. Packages are hermetically sealed with very low vacuum and moisture levels for extended, long-term performance. The 3150 provides vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages.