Plasma-Therm Reactive Ion Etch System, 200mm

March 23, 2011
Plasma-Therm Reactive Ion Etch System 790 Wafer Size Range: Minimum: 50 mm Maximum: 200 mm 11" Electrode Five gas Manufactured in 1998
By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.