Provides optical surface analyzers that automatically detect and classify surface defects on optoelectronic and semiconductor wafers, including transparent wafers such as sapphire and glass.
Photonics advances in 2020 include commercial hollow-core fiber, deep learning for numerous purposes, and advanced ultrafast lasers for materials processing.
Combining white-light interferometry (WLI), phase-shift interferometry (PSI), True Color imaging, and stitching into one optical profiler characterizes flexible electronics devices...
The Archer 500 overlay metrology system for logic and memory chip manufacturers enables lithographers to verify that pattern features have been correctly aligned.
Milpitas, CA--A new generation in KLA-Tencor's family of wafer inspection systems—the Surfscan SP3 with DUV illumination—was introduced for 28 nm and below semiconductor nodes...
San Jose, CA--At the SPIE Microlithography meeting yesterday, Cymer (San Diego, CA) announced a collaboration with KLA-Tencor (San Jose, CA), in which Cymer will provide details...
San Jose, CA--In the last two decades, integrated-circuit (IC)-chip feature sizes have shrunk from a micron in width to one tenth that, and are still shrinking. Over that span...
Many microscopy applications can benefit from broadband deep-UV (DUV) imaging, some of which also require immersion, cover glass correction, or operation over a wide temperature...
KLA-Tencor (San Jose, CA) has acquired Nanopro (Frieburg, Germany), a privately held company specializing in advanced interferometric technology for measuring semiconductor-wafer...
![FIGURE 1. The compact 3D interferometric optical profiler is shown (a) [4]; the x-y stage positions the sample and tilts in two directions to align the sample to the objective lens axis for interferometric measurement. The simplified optical layout (b) is also shown; the focal point of the objective lens is scanned vertically through the measurement distance. A low-coherence-length white-light LED is used for interferometric measurement of topography by WLI, PSI, and True Color measurement of the sample surface at each topographic height determined by interferometry.](https://img.laserfocusworld.com/files/base/ebm/lfw/image/2020/09/2009LFW_rub_1.5f57a66c2a077.png?auto=format,compress&fit=fill&pad=5&fill-color=white&q=45&h=139&height=139&w=250&width=250 "FIGURE 1. The compact 3D interferometric optical profiler is shown (a) [4]; the x-y stage positions the sample and tilts in two directions to align the sample to the objective lens axis for interferometric measurement. The simplified optical layout (b) is also shown; the focal point of the objective lens is scanned vertically through the measurement distance. A low-coherence-length white-light LED is used for interferometric measurement of topography by WLI, PSI, and True Color measurement of the sample surface at each topographic height determined by interferometry.")
